For the common EMC problem, we usually take the following corrective measures which can solve the most of the problems:
We can coat the conducting resin on the mating face of the shields, or add the conductive gasket on the mating face, even use the conductive metal rubber for the remedy. The conductive gasket can be the knitted metal silk thread, soft metal of low rigidity (such as the copper and lead), the rubber of the packaging metal layer, conductive rubber or comb reeds contact fingers.
Under the precondition of not affecting the performance, appropriately adjust the equipment cable and arrangement to mutually insulate the electric cable of different types. Change the common small signal or the high frequency signal cable into the shielded cable; change the common large current signal or the data transmission signal cable into the symmetric wire cable.
Strengthen the mechanical property of the ground connection and reduce the grounding resistance. At the same time, we should have the individual low impedance ground connection and add the serial power supply filter on the equipment power input line.
If possible, we can shield and isolate the important device, for example, we can add metal segregation board of fine ground connection or small shielding case. Input the small parallel capacitance on each device power so as to avoid the high-frequency interference brought by the power supply.
We will discuss the common question and solution as well as the remedial measure in terms of the electronic and electrical products in the test of conducted emission, emission, harmonic current (Harmonic Analyzer), electrostatic discharge (ESD Simulator), electricity rapid pulse, surge and other emc testing.
According to the characters of each project, we divide these contents into three types:
Electromagnetic harassment of launch: conducted emission, radiation emission
Transient pulse resistance of flexibility: electrostatic discharge, electricity rapid pulse, surge impact
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